MediaTek’s Dimensity 9400 Set to Challenge Qualcomm’s Snapdragon 8 Gen 4
MediaTek is gearing up to launch its flagship Dimensity 9400 SoC in October 2024, set to rival Qualcomm’s Snapdragon 8 Gen 4. Featured in OPPO’s Find X8 and Vivo’s X200 series, the Dimensity 9400 boasts a 40% more powerful NPU, enhanced energy efficiency, and advanced AI capabilities, promising to elevate smartphone performance and user experience.
MediaTek Unveils Dimensity 7350 Chipset for Mid-Range Smartphones
Discover MediaTek’s latest offering, the Dimensity 7350 chipset, designed for mid-range smartphones. Boasting 8 cores and advanced features like Armv9 processors, Mali G610 GPU, and MediaTek NPU 657, this chipset promises a balance of performance and affordability. Learn more about its capabilities and limitations in our article.
Intel Introduces Fast Throttle Thermal Throttling Feature for Arrow Lake Processors
Intel is set to introduce Fast Throttle, a per-core thermal throttling solution, to its upcoming Arrow Lake processors. This feature, initially seen on Raptor Lake CPUs, offers precise control over frequency adjustments by turning off CPU clocks for specific durations. Fast Throttle’s per-core adjustments provide a way to optimize performance for overclockers dealing with thermal constraints, setting it apart from traditional methods like TJMax. As Intel prepares to roll out this feature, enthusiasts can expect enhanced overclocking capabilities and improved performance tuning with greater precision.
Samsung Galaxy S25 Series Rumored to Exclusively Use Qualcomm Snapdragon 8 Gen 4 SoC
Recent rumors suggest that the Samsung Galaxy S25 series will be powered by Qualcomm’s Snapdragon 8 Gen 4 SoC, with the Exynos 2500 potentially not being shipped due to yield issues. This marks a shift from previous models and could have significant implications for Samsung’s flagship devices and consumer perception.
MediaTek Unveils Dimensity 7300 Series Chips for High-Tech Devices
MediaTek unveils the Dimensity 7300 Series Chips, promising top-notch performance and power efficiency for high-tech smartphones and foldable devices. With features like seamless multitasking, superior photography, enhanced gaming experiences, and AI-driven computing capabilities, these 4nm chips are set to revolutionize the market. The Dimensity 7300X, tailored for flip-style foldable devices, offers support for dual displays. With an octa-core CPU configuration and Arm Mali-G615 GPU, the Dimensity 7300 series delivers accelerated gaming performance and superior energy efficiency. The chips also enhance photography capabilities with the MediaTek Imagiq 950, supporting a 200MP main camera and advanced video recording features. Integrated with MediaTek’s MiraVision 955, the Dimensity 7300 SoCs offer WFHD+ displays with 10-bit true color and global HDR standards. Overall, the Dimensity 7300 and Dimensity 7300X provide a comprehensive technological solution for the evolving smartphone and foldable device market.
MediaTek Unveils Dimensity 8250 Chipset with Enhanced Features
Discover the new MediaTek Dimensity 8250 chipset, featuring enhanced performance and impressive features. With a 4nm TSMC node, powerful CPU and GPU configurations, support for high-resolution displays, fast memory and storage options, advanced camera capabilities, built-in AV1 decoding, 5G connectivity, and efficient AI computation, the Dimensity 8250 sets new standards in the mid-range segment. Stay tuned for the Oppo Reno12 launch on May 23, the first smartphone to feature this groundbreaking chipset.
HTC Launches A101 Plus Edition Tablet with Unisoc T606 Chipset
HTC officially launches the A101 Plus Edition tablet with Unisoc T606 chipset, 10.95-inch IPS touchscreen, 8GB RAM, and 128GB storage. Priced at RUB 15,990, the tablet runs on Android 14 and features dual 13 MP rear cameras, 8 MP selfie camera, and 7,000 mAh battery. Available in gray and silver colors, the HTC A101 Plus Edition is targeted at specific markets.
MediaTek CEO Announces Launch of Dimensity 9400 in Q4 2024 with Advanced AI Capabilities
MediaTek CEO Says The Company’s New Dimensity 9400 Will Launch In Q4 2024, Will Arrive With Advanced AI Capabilities Omar Sohail•Jan 31, 2024 12:26 AM EST The Dimensity 9400 will be MediaTek’s first 3nm chipset that is said to take…