NVIDIA is rumored to be working on its next-gen ‘AI PC’ SOC that could potentially revolutionize the AI PC segment. The speculated specs include Arm-based Blackhawk CPUs, Blackwell RTX GPUs, and LPDDR6 memory all integrated into a single package.
Recent reports suggest that NVIDIA is gearing up to enter the client PC market with its own SOC, which could pave the way for new consoles, particularly handheld devices. The CEOs of NVIDIA and Dell have hinted at this development, and now a new rumor sheds light on the possible configuration of these upcoming SOCs.
The information, sourced from @XpeaGPU, indicates that NVIDIA is planning to combine multiple next-generation IPs into a single package. This approach aligns with the trend seen in modern PC designs, such as Apple’s integration of multiple IPs on the same die with on-package memory and Intel’s Lunar Lake architecture.
For its next-gen SOC, NVIDIA is reportedly eyeing a 3nm process node from either Intel or TSMC, along with an advanced packaging solution to bring together Arm-based Cortex X5 BlackHawk CPU cores and Blackwell RTX GPU cores. The collaboration with MediaTek for the BlackHawk CPU cores further strengthens the plausibility of this configuration.
MediaTek, known for its upcoming Dimensity 9400 chip, is also utilizing the Arm architecture to rival competitors like Apple’s A17 Pro and Qualcomm’s Oryon architecture. The potential use of Blackwell RTX GPUs in NVIDIA’s SOC aligns with MediaTek’s previous confirmation of incorporating the latest RTX and AI GPU IP in its Dimensity SOCs.
Moreover, the NVIDIA ‘AI PC’ SOCs are expected to feature LPDDR6 memory as an on-package design. The LPDDR6 memory is projected to offer speeds starting at 10,667 MT/s and could reach up to 14,400 MT/s over its lifecycle, as per recent disclosures.
