Tech/Science

Exynos 2400: Revolutionizing Mobile Gaming and AI Experience

The latest mobile processor, the Exynos 2400, is set to revolutionize the mobile gaming and AI experience, bringing a new level of performance and efficiency to mobile devices.

Bringing Mobile Experiences to a New Level

The Exynos 2400 is designed to enhance mobile experiences with its hardware-accelerated ray tracing, offering a new level of realism to gaming. The Xclipse 940 GPU, built on AMD RDNA™ 3 architecture, brings hardware-accelerated ray tracing to mobile gaming, creating realistic shadows and reflections for a more immersive gaming experience. The CPU, powered by the Arm® Cortex®-X4, ensures super responsive gameplay, while the 4K 120Hz display refresh rates provide smooth and stable movements during high-intensity exchanges.

On-Device AI for Enhanced Functionality

With improved on-device AI support, the Exynos 2400 enables users to fix photos, translate languages in real-time, and perform various tasks with improved efficiency and lower latency. Compared to its predecessor, the Exynos 2400 offers a 14.7x improvement in AI performance, delivering a significant boost in security and privacy as more data is processed on the device itself.

Efficient Performance and Thermal Management

The Exynos 2400 is equipped with a tri-cluster structure deca-core CPU and hexa-core GPU, optimizing performance while minimizing power consumption. The processor’s 3rd generation 4nm low-power process node contributes to faster apps and longer battery life. Additionally, the Exynos 2400 utilizes a Fan-out Wafer Level Package (FOWLP) for enhanced thermal management, allowing users to push games and apps further and longer without overheating.

Adaptable Performance and Thermal Management

Featuring ten total cores, including one large, five mid-size, and four small cores, the Exynos 2400 offers more adaptable performance and efficiency. The tri-cluster structure ensures that power and efficiency are optimized for various processing requirements. Furthermore, the FOWLP packaging enhances thermal management, contributing to the overall efficiency and performance of the Exynos 2400.

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